FB250XH1-WDRxxWB_FB250XH1-WDVxxWB_FB250XH4-WSRxxNx_FB250XH1-WSVxxNx

2.50mm JST-XH series Wire to Board Connector

.P/N:FB250XH1-WDRxxWB
.Welding Form:DIP
.Circuit:2~16P
.Packing Method:Bag
.Alternative with:JST-XH series

.P/N:FB250XH1-WDVxxWB
.Welding Form:DIP
.Circuit:2~16P
.Packing Method:Bag
.Alternative with:JST-XH series

.P/N:FB250XH1-WSVxxNx
.Welding Form:SMT
.Circuit:2~16P
.Packing Method:Reel
.Alternative with:JST-XH series

.P/N:FB250XH4-WSRxxNx
.Welding Form:SMT
.Circuit:2~16P
.Packing Method:Reel
.Alternative with:JST-XH series
Product Description
Designed for applications requiring high reliability and fine-pitch interconnects—such as instrumentation, control boards, and electronic modules—the 2.50mm JST-XH series Wire to Board Connector follows the JST XH standard with a 2.5mm pitch. It is well-suited for low to medium current transmission and serves as an essential component for connecting wires to PCBs. With a robust wafer construction, it is available in multiple pin counts (2 to 16 pins) and supports both top-entry and side-entry mating to accommodate diverse PCB layouts and assembly needs.

As a high-performance Wire to Board Connector, its terminals are manufactured from highly conductive alloy to ensure excellent contact performance and stable conductivity. The housing is molded from heat-resistant plastic, providing resistance to high temperatures, chemicals, and long-term environmental stress. This series is engineered for OEM/EMS customers with consistent quality and traceable manufacturing processes, meeting requirements for high-volume orders as well as customized pin configurations.

Whether used for wiring electronic control modules, industrial automation equipment, or maintenance spare parts, the 2.50mm JST-XH series wafer connector delivers stable quality and assembly convenience. Bulk inquiries and sample requests are welcome to help you quickly integrate and improve the efficiency of your product assembly.

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2.50mm JST-XH series Wire to Board Connector
.P/N:FB250XH1-WDRxxWB .Welding Form:DIP .Circuit:2~16P .Packing Method:Bag .Alternative with:JST-XH series .P/N:FB250XH1-WDVx ...
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