FGFI125SR
1.25mm JAE-FI series Wire to Board Connector
．P/N：FB125FI-WSRxxxx-x
．Welding Form：SMT
．Circuit：2~15P
．Packing Method：Reel
．Alternative with JAE-FI series
．Welding Form：SMT
．Circuit：2~15P
．Packing Method：Reel
．Alternative with JAE-FI series
Specification
· Current rating: 1A(28AWG)
· Voltage rating: 200V AC/DC
· Contact resistance: 30mΩ Max.
· Insulation resistance: 100MΩ Min.
· Withstand voltage: 500V/AC for 1 minute
· Temperature range: -25℃~+85℃
· Voltage rating: 200V AC/DC
· Contact resistance: 30mΩ Max.
· Insulation resistance: 100MΩ Min.
· Withstand voltage: 500V/AC for 1 minute
· Temperature range: -25℃~+85℃
