褔軒科技「低壓成型LPM」電子元件包覆製程
Process of Low Pressure Molding (LPM)
Fullgory Technology Co., Ltd. utilizes an advanced packaging technology, which has been used in Europe and America, Low Pressure Molding (LPM) technology, with Hot-melt adhesive (polyamide and polyolefin) to capsulate precise electronic components. Because LPM’s injection pressure is small, molding temperature is low, will not damage the components be capsulated and effectively improve molding process yield rate. After completing component encapsulation, it will have the advantages with insulation, impact resistance, and waterproof, resistant to high temperature, dust and corrosion resistance.
No housing required.
Insert parts directly into moldset.
Process step eliminated.
30 sec. - 2 min. encapsulation process.
Process step eliminated.
Thermoplastic material does not require cure.
Parts handled immediately after molding.
Positive of Low Pressure Molding (LPM)
LPM uses Hot-melt adhesive of high-liquidity, which is injected into mold with low pressure (1.5～40bar), it is cured fast (5~50 seconds) and has excellent sealing effect. The component capsulation layer of LPM could be produced to irregular outline, thickness according to different requirements. It can eliminate the housing produced by traditional plastic ejection. Comparing “Low Pressure Molding” and traditional plastic “Ejection Molding”, the former (LPM) has the advantages of small size of finished product, higher degree of freedom of product shape and higher yield rate of molding.
PCB LPM
Coil LPM
Cable LPM
Products Purchase guide
How to choose the right mobile cable?
Different types of mobile transmission cables have various advantages and disadvantages that need to be considered…
LPM ( Low Pressure Molding )
Low-pressure molding can be used to process various components such as PCB circuit boards, coils, wires, waterproof connectors, microswitches, automotive sensors, etc.
Coming soon
